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Thermally conductive urethane adhesive


DIS-A-PASTE 2000-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat.

DIS-A-PASTE 2000-A/B is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured.

DIS-A-PASTE 2000-A/B is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.


  • Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates
  • Low Tg for excellent low temperature cycling and performance
  • Excellent substrate adhesion; superior to silicones
  • Exceeds NASA outgassing requirements for high vacuum environments
  • Bonds DAT-A-THERM 1000 film to devices and substrates without loss of thermal conductivity
  • Thixotropic version available for non-sag bonding and staking, designated as DIS-A-PASTE 2000T-A/B. Handle, mix and use the same way as DIS-A-PASTE 2000-A/B.
  • Pre-measured kits available upon request. Easy to handle for small jobs and eliminates weighing.