TECHNICAL DATA & INFORMATION - Click to view complete technical
- Thermally conductive, silicone potting compound
- Re-enterable for repairability
- Wide operating temperature range (-100°C to +260°C)
PRODUCT DESCRIPTION
DIS-A-PASTE 2716-A/B is a two component, filled, thermally conductive potting compound. It is designed for the potting and encapsulation of electrical/electronic components and substrates.
- Very low mixed viscosity to enhance the potting/encapsulation of intricate parts
- Long pot life and low exotherm for mass casting of parts up to 5” thick
- Very low Tg (-100°C) for excellent low temperature cycling and performance
- Excellent substrate adhesion when used in conjunction with G.E. SS 4155 primer or DC 1200 primer
- Available in dual cartridge kits for convenient dispensing to circuit board